Cutting and dicing saws provide efficient and accurate methods for preparing samples for use or analysis. This equipment is used to section materials into smaller, more manageable pieces.
Applications include:
- Microscopy sample preparation
- Electrode production
- Creating thin films and wafers
The type of equipment chosen is dependent on the material being processed. Factors to consider are:
- Size of blade or wire required
- Blade or wire material
- Requirement of coolant
- Stand adjustability
- Cutting speed and pressure
PI-KEM, as distributor of MTI Corporation, can supply their full range of cutting and dicing saws.
Diamond Blade Saw
- Diamond and silicon carbide blades
- High or low speed
- Manual or programmable
- Use to cut materials including rough crystal, ceramic, and metal rod
- Sample punchers and scribes for marking
Options:
- Integrated cooling system
- Bench top or floor-standing
- Wet or dry
Click here for the full MTI range
Precision Diamond Wire Saw
- Wires can be bought individually
- Manual or programmable
- Up to 40” diameter substrate
Options:
- PC control
- Adjustable sample stage
- Microscope head
Click here for the full MTI range
Disc & Die Cutters
- Handheld, manual, or high throughput vacuum
- Discs up to 24mm
- Manual or programmable
- Up to 40” diameter substrate
Options:
- PC control
- Adjustable sample stage
- Microscope head
Click here for the full MTI range
